Selective Soldering: A Need for Innovation and Development
Samuel J. McMaster*1, Andrew Cobley1, John E. Graves1, Nigel Monk2 1. Introduction Selective soldering utilises a nozzle to apply solder to components on the underside of printed circuit boards (PCBs). This nozzle can be moved to either perform dips (depositing solder to a single component) or draws (applying solder to several components in a single […]
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